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Displaying items by tag: Tyvak

Wednesday, 17 October 2012 19:15

Intrepid 1U CubeSat Suite

The Intrepid 1U CubeSat Suite represents a compact and capable complete 1U system.

Tyvak have bundled the Tyvak™ Intrepid System Board with a custom UHF Communication System (70cm Amateur Band), Side Panels with Sensors, Torquers, Solar Cells, and a Monopole Antenna, a Battery Module, and a structure that makes optimal use of limited volume. The highly integrated nature of the design enables mission concepts previously unfeasible in only a 1U volume, passing launch savings to the end user. With a custom Embedded Linux platform interfacing all the subsystem components, developers can hit the ground running from day one in a familiar development environment.

 

This product is part of the “Pico-Class” products provided by the company Tyvak Nano-Satellite Systems LLC.

The “Pico-Class” products focuses on providing core capabilities that represent the smallest packaging solution.

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Wednesday, 17 October 2012 09:03

Intrepid Embedded Linux System Board

The Intrepid Embedded Linux System Board reimagines the CubeSat, providing capabilities integrated as a single board solution. The design fully conforms to the CubeSat specification, and solves many of the design challenges developers face by including the Electrical Power System, Command and Data Handling System, a custom Embedded Linux OS with device drivers already in place, and post-deployment power-up interfaces. Standard Interfaces include two ultra-low profile daughter boards for custom communication systems, battery modules, or payload electronics, and payload interface connectors providing power and data. Two high-pin count umbilical connectors provide complete debugging access to data lines and peripherals provided to the payload even when fully integrated with the most complex systems.

This product is part of the “Pico-Class” products provided by the company Tyvak Nano-Satellite Systems LLC.

The “Pico-Class” products focuses on providing core capabilities that represent the smallest packaging solution.

 

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